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0.05mm Fine Wire Silver-Plated Copper Wire for Electrical Components
| Place of Origin | Shanghai |
|---|---|
| Brand Name | Huona |
| Certification | ISO9001 |
| Model Number | Silver-Plated Copper Wire |
| Minimum Order Quantity | 10kg |
| Price | Negotiable |
| Packaging Details | Carton/Wooden Case |
| Delivery Time | 5-21 days |
| Payment Terms | T/T,Western Union |
| Supply Ability | 500 tons per month |
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xProduct Details
| Product Name | Silver-Plated Copper Wire | Diameter | 0.05mm (±0.002mm) |
|---|---|---|---|
| Plating Thickness | 0.5–2.0μm | Tensile Strength | 350–450 MPa (Hard Drawn); 200–280 MPa (Annealed) |
| Elongation | ≥15% | Conductivity | ≥105% IACS (20°C) |
| Operating Temperature | -60°C To +200°C | Plating Material | Pure Silver |
| Highlight | 0.05mm silver-plated copper wire,fine wire for electrical components,silver-plated copper wire with warranty |
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Product Description
0.05mm Fine Wire Silver-Plated Copper Wire for Electrical Components
Product Overview
Silver-plated copper wire (0.05mm single strand) from Huona New Material is a high-performance ultra-fine conductor composed of high-purity oxygen-free copper (OFC) core and a uniform silver plating layer. Produced via precision drawing and continuous electroplating processes, this 0.05mm micro-wire delivers ultra-high electrical conductivity, excellent oxidation resistance, and superior corrosion resistance. With a diameter tolerance of ±0.002mm and plating thickness of 0.5-2.0μm, it is widely used in miniaturized electronic components, aerospace wiring, and high-frequency signal transmission applications.
Standard Designations & Core Material Foundation
- Base Material: High-purity oxygen-free copper (OFC, ≥99.99%)
- Plating Material: 99.9% pure silver
- Key Specification: 0.05mm single strand (diameter tolerance ±0.002mm)
- Plating Thickness: 0.5-2.0μm (customizable)
- Compliant Standards: ASTM B500, GB/T 4910, IEC 60884
- Manufacturer: Huona New Material, certified to ISO 9001 and IATF 16949, with advanced ultra-fine wire drawing and plating lines
Key Core Advantages
Ultra-High Conductivity & Signal Transmission
- Enhanced Conductivity: Silver (σ=63×10⁶ S/m) has higher conductivity than copper, reducing signal loss in high-frequency applications. The 0.05mm diameter ensures minimal skin effect impact, making it ideal for high-speed data transmission in miniaturized devices.
- Low Contact Resistance: The silver plating provides a low-resistance surface, ensuring reliable electrical connections in connectors and switches, even after repeated mating cycles.
Excellent Oxidation & Corrosion Resistance
- Silver Protective Layer: The dense silver plating prevents copper oxidation at high temperatures or in humid environments, maintaining stable conductivity over time.
- Corrosion Resistance: Resists sulfurization and most chemical corrosion, suitable for harsh environments such as aerospace and industrial control systems.
Superior Mechanical Properties & Processability
- High Ductility: Despite its ultra-fine 0.05mm diameter, the wire maintains good ductility (elongation ≥15%), enabling bending and winding on extremely small mandrels (≥0.1mm) without breaking.
- Uniform Plating: Advanced electroplating technology ensures a uniform silver layer with no peeling or blistering, even after severe drawing and annealing processes.
Technical Specifications
| Attribute | Value (Typical) |
|---|---|
| Base Material | Oxygen-Free Copper (OFC) |
| Plating Material | Pure Silver |
| Diameter | 0.05mm (±0.002mm) |
| Plating Thickness | 0.5-2.0μm |
| Tensile Strength | 350-450 MPa (Hard Drawn); 200-280 MPa (Annealed) |
| Elongation | ≥15% |
| Conductivity | ≥105% IACS (20°C) |
| Operating Temperature | -60°C to +200°C |
| Surface Finish | Bright silver, smooth, no oxidation |
Product Specifications
| Item | Specification |
|---|---|
| Supply Form | Spools (100m/500m/1000m per spool) |
| Plating Type | Soft silver plating (for soldering) or hard silver plating (for wear resistance) |
| Packaging | Vacuum-sealed bags + anti-static packaging + outer carton |
| Customization | Diameter (0.02-0.1mm); plating thickness; pre-tinning |
Typical Application Scenarios
- Miniaturized Electronics: Used in fine-pitch connectors, bonding wires, and flexible circuits for smartphones, wearables, and medical devices.
- Aerospace & Defense: High-frequency signal wires, sensor leads, and lightweight wiring harnesses in aircraft and satellite systems.
- High-Frequency Communication: RF cables, antenna elements, and microwave components requiring low loss and high conductivity.
- Automotive Electronics: Sensor wires and high-speed data lines in advanced driver-assistance systems (ADAS).
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