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TO63-03A Hermetic Sealing Package for Power Devices
| Place of Origin | JIANGSU |
|---|---|
| Brand Name | HUONA |
| Certification | ISO9001 SGS |
| Model Number | top |
| Minimum Order Quantity | 100 |
| Price | Negotiation |
| Packaging Details | Case |
| Delivery Time | A WEEK |
| Payment Terms | T/T |
| Supply Ability | 100000 A WEEK |
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xProduct Details
| Housing Material | Kovar Alloy Or 304 Stainless Steel | Number Of Pins | 3 Pins (customizable To 4, 6,8 Etc.) |
|---|---|---|---|
| Plating Options | Nickel, Gold (0.5–2μm Thickness) | Glass Insulator | Borosilicate Or High-insulation Custom Glass |
| Hermeticity | ≤1×10⁻⁸ Atm·cc/sec (He Leak Test) | Dimensional Customization | Available Upon Customer Drawings |
| Highlight | TO63-03A hermetic sealing package,power device TO header,hermetic TO63 power package |
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Product Description
High-Reliability TO63-03A Hermetic Sealing Package
Product Overview
Model Number: TO63-03A
Package Type: TO-style metal can (Transistor Outline)
Sealing Technology: Glass-to-Metal Sealing (GTMS)
Materials
- Housing: Kovar alloy (Fe-Ni-Co) or stainless steel
- Pins: Kovar, Dumet, or custom conductive materials
- Insulation Medium: Borosilicate or high-insulation glass
Key Features & Advantages
- Excellent hermeticity with leak rate ≤1×10⁻⁸ atm·cc/sec (helium leak test)
- Wide temperature range from -55°C to +300°C for extreme environments
- Strong mechanical structure with high resistance to vibration and shock
- Effective thermal path through the TO-style metal base
- Full customization available for pin configuration, plating thickness, and housing size
Technical Specifications
| Attribute | Specification / Range |
|---|---|
| Housing Material | Kovar alloy or 304 stainless steel |
| Number of Pins | 3 pins (customizable to 4, 6, 8 etc.) |
| Plating Options | Nickel, Gold (0.5–2μm thickness) |
| Glass Insulator | Borosilicate or high-insulation custom glass |
| Hermeticity | ≤1×10⁻⁸ atm·cc/sec (He leak test) |
| Operating Temperature | -55°C to +300°C |
| Surface Finish | Nickel plated, gold plated, or blackened |
Application Fields
- Laser diode and VCSEL packaging
- Infrared sensor and detector modules
- Power electronics: IGBT, MOSFET, and high-current transistors
- RF and microwave device packaging
- Medical sensor modules requiring hermetic enclosures
- Aerospace, defense, and industrial electronics
Available Documentation & Support
- 2D/3D drawings in PDF or STEP format
- Helium leak and material composition reports
- RoHS and REACH compliance certificates
- OEM/ODM customization from prototype to volume
- Technical consulting for packaging layout and thermal design
Our R&D department can design your product following your specific requirements.
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